SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Title:

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Document Type and Number:

Japanese Patent JP2009277949

Kind Code:

A

Abstract:

To provide a semiconductor device and a method of manufacturing the same by means of which a semiconductor backside and a die pad never peel off each other, deterioration in characteristics caused by a decrease in heat dissipation property and an increase in resistance due to peeling is prevented, and the semiconductor device which has high reliability is stably obtained in good yield.

When a plurality of semiconductor elements are arrayed and mounted on the die pad 2, and sealed in one package with a resin to obtain multi-element constitution, a semiconductor element 41 is mounted on the die pad 2 with solder 61 of 2 to 15 m in thickness and the remaining semiconductor elements 42 are mounted on the die pad 2 with a dice bonding material 62 made of an epoxy resin such as silver paste.

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Inventors:

NOZAKI YOICHIRO
ITO KENICHI

Application Number:

JP2008128963A

Publication Date:

November 26, 2009

Filing Date:

May 16, 2008

Export Citation:

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Assignee:

PANASONIC CORP

International Classes:

H01L25/04; H01L21/52; H01L23/50; H01L25/07; H01L25/18

Attorney, Agent or Firm:

Yohei Harada
Yoshihiro Morimoto
Toshiji Sasahara

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