To provide a technology capable of preventing the propagation of basal plane dislocation from a semiconductor layer having the basal plane dislocation to a crystally grown semiconductor layer without performing etching treatment.
A method includes: a specifying step of specifying the position 8 of the basal plane dislocation 6 on the surface 2a of the semiconductor layer 2; a crystal re-array step of re-arraying crystals at the position 8 specified in the specifying step; and a crystal growth step of crystally growing the semiconductor layer from the surface 2a after the crystal re-array step. By the method, the basal plane dislocation 6 is not propagated to the crystally grown semiconductor layer. Since the basal plane dislocation 6 is not propagated to the crystally grown semiconductor layer, a leakage current is suppressed.
COPYRIGHT: (C)2010,JPO&INPIT
WATANABE YUKIHIKO
YAMAMOTO TAKEO
ENDO TAKESHI
FUJIWARA HIROKAZU
KONISHI MASAKI
DENSO CORP
TOYOTA MOTOR CORP
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