To provide an artifice improving the uniformity of a height of an underfill formed on an end surface around a semiconductor element by a simple method to improve quality and reliability of a semiconductor device.
A semiconductor device includes: a circuit board 2 having a plurality of surface electrodes made of a metal on a surface thereof and external connection terminals 4 made of a metal while arranged in a grid on a rear surface thereof; a semiconductor element 1 flip-chip connected to the surface electrodes of the circuit board and having a rectangular plate shape; and an underfill resin 3 existing between the circuit board and the semiconductor element while being brought into contact with the four sides of the rectangle of the semiconductor element. A dam member 8 surrounding the semiconductor element is formed on the surface of the circuit board, and a distance between the dam member and the semiconductor element is smaller at the corner than at the center of the side of the semiconductor element.
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura