Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011210913
Kind Code:
A
Abstract:
To provide a means for manufacturing a semiconductor device at low cost, the semiconductor device that is formed by laminating two or more semiconductor elements.
The semiconductor device 31 has a first semiconductor element 10 mounted on a circuit board 1 and a connection terminal 26 of a second semiconductor element 20 joined to a solder bump 17 on a first electrode pad 14 of the first semiconductor element 10. Second and third electrode pads 15 and 16 of the first semiconductor element 10 are electrically connected to the circuit board 1 through a wire 18. The distance H0 between the first and second semiconductor elements 10 and 20 is so set as being ≥the height H1 of the wire 18 loop by the tall connection terminal 26.
Inventors:
IMAIZUMI NOBUHIRO
AKAMATSU TOSHIYA
MIZUKOSHI MASATAKA
AKAMATSU TOSHIYA
MIZUKOSHI MASATAKA
Application Number:
JP2010076592A
Publication Date:
October 20, 2011
Filing Date:
March 30, 2010
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L25/065; H01L21/3205; H01L21/60; H01L23/52; H01L25/07; H01L25/18
Domestic Patent References:
| JP2004327993A | 2004-11-18 | |||
| JP2009105335A | 2009-05-14 | |||
| JP2005150441A | 2005-06-09 | |||
| JPH1056041A | 1998-02-24 | |||
| JP2009021329A | 2009-01-29 | |||
| JPH1092867A | 1998-04-10 | |||
| JPH08279528A | 1996-10-22 |
Attorney, Agent or Firm:
Mitsuharu Kawakami
Previous Patent: METHOD OF PROCESSING MULTILAYER PRINTED WIRING BOARD
Next Patent: WALL-HANGING DEVICE AND MOUNTING METHOD OF THE SAME
Next Patent: WALL-HANGING DEVICE AND MOUNTING METHOD OF THE SAME