Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2020150226
Kind Code:
A
Abstract:
To provide a semiconductor device capable of providing a pad suitable for sticking, and a method for manufacturing the same.SOLUTION: According to an embodiment, a semiconductor device comprises a first chip including: a first wiring layer; a first insulation film provided on the first wiring layer; a first metal portion provided on the first wiring layer in the first insulation film and containing at least any of palladium, platinum, and gold; and a second wiring layer provided on the first metal portion in the first insulation film. The semiconductor device further comprises a second insulation film provided on the first insulation film, and a third wiring layer provided on the second wiring layer in the second insulation film.SELECTED DRAWING: Figure 4
Inventors:
TANAKA YUSUKE
HIENO ATSUSHI
NAKANISHI TSUTOMU
YOSHIMIZU YASUTO
TAGAMI MASAYOSHI
HIENO ATSUSHI
NAKANISHI TSUTOMU
YOSHIMIZU YASUTO
TAGAMI MASAYOSHI
Application Number:
JP2019048964A
Publication Date:
September 17, 2020
Filing Date:
March 15, 2019
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
H01L21/3205; H01L21/336; H01L21/60; H01L21/768; H01L23/522; H01L25/065; H01L25/07; H01L25/18; H01L27/11582; H01L29/788; H01L29/792
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi
Yukitaka Nakamura
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi