Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7332528
Kind Code:
B2
Abstract:
An object is to provide a technique capable of suppressing insulation defects caused by the arrival of bubbles contained in an adhesive at a circuit pattern in a semiconductor device. A semiconductor device includes the resin-insulated copper base plate having the copper base plate, the insulating layer provided on the upper surface of the copper base plate, and the circuit pattern provided on the upper surface of the insulating layer, the semiconductor element mounted on the upper surface of the resin-insulated copper base plate, the case joined to the outer peripheral portion of the resin-insulated copper base plate via the adhesive, the sealing material sealing, in the case, the upper surface of the resin-insulated copper base plate and the semiconductor element, and the roughening patterns formed on the upper surface of the insulating layer such that the circuit pattern is enclosed therewith in a plan view.
Inventors:
Shotaro Sakumoto
Application Number:
JP2020073835A
Publication Date:
August 23, 2023
Filing Date:
April 17, 2020
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L23/28; H01L25/18
Domestic Patent References:
| JP2004228286A | ||||
| JP11087567A | ||||
| JP2019079967A |
Foreign References:
| WO2017094189A1 | ||||
| WO2018211751A1 |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita