Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008294323
Kind Code:
A
Abstract:
To provide a semiconductor device which can excellently be bonded to another semiconductor device or a substrate and has excellent manufacture stability, and to provide the method of manufacturing the semiconductor device.
The semiconductor device 1 has a semiconductor substrate 11 and a conductor post portion 121 projecting from the semiconductor substrate 11. The conductor post portion 121 is provided to the semiconductor substrate 11 without forming a hollow portion on an external surface from the tip to the base end on the side of the semiconductor substrate 11 in a direction crossing the projection direction of the conductor post portion 121.
Inventors:
KURITA YOICHIRO
Application Number:
JP2007139971A
Publication Date:
December 04, 2008
Filing Date:
May 28, 2007
Export Citation:
Assignee:
NEC ELECTRONICS CORP
International Classes:
H01L25/065; H01L21/3205; H01L23/12; H01L23/52; H01L25/07; H01L25/18
Domestic Patent References:
| JP2006502582A | 2006-01-19 | |||
| JP2005277059A | 2005-10-06 | |||
| JPH1070127A | 1998-03-10 | |||
| JP2003003290A | 2003-01-08 |
Attorney, Agent or Firm:
Shinji Hayami