To precisely and securely detect and correct the dislocation of a semiconductor device and a wiring board.

Contact terminal pairs 12, 24 and 13 and 25 which can electrically be made into contact each other are arranged between the semiconductor device 20 and the wiring board 10, and a pair of detection terminals 22 and 23 are arranged in the mutually detached positions of the semiconductor device 20. When the semiconductor device 20 is matched with the regular mounting position of the wiring board 10, a pair of the contact terminals 12 and 24 are brought into contact with a pair of the terminals 13 and 25. A pair of detection terminals 22 and 23 can be conducted through a detection circuit 130 constituted of the contact terminal pairs 12 and 24, and 13 and 25 and the detection wirings 14 and 26.