Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2018186302
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device that increases the number of semiconductor elements mounted in parallel and inhibits a shape of an insulating substrate on which the semiconductor elements are mounted from becoming laterally long and a semiconductor module including the same.SOLUTION: A semiconductor device 100 includes: an insulating substrate 1; a series of metal patterns 2 joined to one main surface of the insulating substrate 1; and a plurality of switching elements 31, 32, 33, 41, 42, 43 joined to a surface of the metal pattern 2 opposite to the insulating substrate 1.SELECTED DRAWING: Figure 1
Inventors:
HASEGAWA SHIGERU
UMEZAKI ISAO
TSUDA AKIRA
HAYASHIDA YUKIMASA
DATE RYUTARO
UMEZAKI ISAO
TSUDA AKIRA
HAYASHIDA YUKIMASA
DATE RYUTARO
Application Number:
JP2018153922A
Publication Date:
November 22, 2018
Filing Date:
August 20, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| JP2015142059A | 2015-08-03 | |||
| JP2014130909A | 2014-07-10 | |||
| JP2013125806A | 2013-06-24 | |||
| JP2015018943A | 2015-01-29 | |||
| JPS6163367U | 1986-04-30 |
Foreign References:
| WO2013132644A1 | 2013-09-12 | |||
| WO2014192093A1 | 2014-12-04 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita