To provide a semiconductor device in which each element is formed on each surface of a semiconductor base material having a number of the surfaces and circuits on each surface are connected electrically, a production device for the semiconductor device in which each element is formed on a number of the surfaces, and an inspection device for the semiconductor device.
The semiconductor device has the tabular semiconductor base material 11 and each element 2 and 3 formed on the two main surfaces of the surface and the rear of the base material 1, and has a connecting means for electrically connecting each element 2 and 4 on the main surface on the surface side and each element 2 and 4 on the main surface on the rear side on the outsides of the end faces of the base material 1. The connecting means preferably contains wires 5 for wiring.
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai