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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE, PRODUCTION DEVICE THEREFOR AND INSPECTION DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2004342832
Kind Code:
A
Abstract:

To provide a semiconductor device in which each element is formed on each surface of a semiconductor base material having a number of the surfaces and circuits on each surface are connected electrically, a production device for the semiconductor device in which each element is formed on a number of the surfaces, and an inspection device for the semiconductor device.

The semiconductor device has the tabular semiconductor base material 11 and each element 2 and 3 formed on the two main surfaces of the surface and the rear of the base material 1, and has a connecting means for electrically connecting each element 2 and 4 on the main surface on the surface side and each element 2 and 4 on the main surface on the rear side on the outsides of the end faces of the base material 1. The connecting means preferably contains wires 5 for wiring.


Inventors:
MORIMOTO KIYOSHI
Application Number:
JP2003137400A
Publication Date:
December 02, 2004
Filing Date:
May 15, 2003
Export Citation:
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Assignee:
RENESAS TECH CORP
International Classes:
H01L21/02; H01L21/3205; H01L21/60; H01L23/52; G01R31/28; (IPC1-7): H01L21/02; G01R31/28; H01L21/3205; H01L21/60
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai