Title:
SEMICONDUCTOR DEVICE THREE-DIMENSIONAL SEMICONDUCTOR DEVICE USING IT AND ITS MANUFACTURING METHOD AS WELL AS TEMPLATE
Document Type and Number:
Japanese Patent JP3424627
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of forming a three- dimensional semiconductor device of two stages or more or three stages or more of multi-stage connecting structure by using only one type of the semiconductor device, the three-dimensional semiconductor device using it and a method for manufacturing it as well as a template.
SOLUTION: The semiconductor device 1 has an integrated circuit formed on a board, and pads 3 formed to electrically connect the circuit. The device 1 comprises a multi-stage connecting electrode 2 for electrically connecting the other semiconductor device and plane electric connectors 4 connected to the pads 3 to become a circuit pattern.
Inventors:
Naoji Semba
Takao Yamazaki
Yuzo Shimada
Takao Yamazaki
Yuzo Shimada
Application Number:
JP33677399A
Publication Date:
July 07, 2003
Filing Date:
November 26, 1999
Export Citation:
Assignee:
NEC
International Classes:
H01L23/12; H01L23/52; H01L25/065; H01L25/07; H01L25/10; H01L25/11; H01L25/18; (IPC1-7): H01L25/065; H01L23/52; H01L25/07; H01L25/18
Domestic Patent References:
| JP11145381A | ||||
| JP469963A | ||||
| JP1065096A | ||||
| JP2000216330A | ||||
| JP2001144218A |
Attorney, Agent or Firm:
Nobuo Takahashi (3 outside)