Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2002164507
Kind Code:
A
Abstract:
To enable the ratio of effective area of a chip to be increased and simplify test work by reducing wiring inside and outside a semiconductor chip and the number of electrode pads necessary for the semiconductor chip.
Serial/parallel conversion parts 4-1, 4-2 which convert serial data and parallel data mutually are disposed in the respective function blocks 2-1, 2-2 in the semiconductor chip 1, and the input and output of data between the respective function blocks 2-1, 2-2 are performed by using serial data. As a result, the number of wirings in the chip can be reduced by arranging only the number of wirings which is necessary for transmission of the serial data.
Inventors:
IKEDA TAKESHI
MIYAGI HIROSHI
MIYAGI HIROSHI
Application Number:
JP2000356673A
Publication Date:
June 07, 2002
Filing Date:
November 22, 2000
Export Citation:
Assignee:
NIIGATA SEIMITSU KK
International Classes:
H01L21/822; H01L27/04; H03M9/00; (IPC1-7): H01L27/04; H01L21/822
Attorney, Agent or Firm:
Kazuyuki Tachibana
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