To provide a semiconductor device having a short line length, suppressing troubles such as the delay of a signal, a line-to-line interference, the increase of noises or the like, and having high reliability.

The semiconductor device is composed of a plurality of input- output terminals 1b or the like formed in circuit forming sections 1 to 6 for a semiconductor chip 20, a plurality of internal wirings 1c or the like led out from a plurality of the input-output terminals, a plurality of electrode pads 1a to 6a connected to each input-output terminal through the internal wirings, an insulating layer 7 formed on the circuit forming sections, and a plurality of rewiring configurations 9 in which ends are connected to the electrode pads and which are formed on the insulating layer. A plurality of the electrode pads are formed into the circuit forming sections for the semiconductor chip 20, and the length in total of a plurality of rewiring configurations is made shorter than the total distances from each input-output terminal to the outer edges of the circuit forming sections.