To provide a reliable semiconductor device which capable of solving a disconnection problem of interconnections by electrolytic corrosion caused by the occurrence of an uncured portion in an anisotropic conductive adhesive material, when mounting a semiconductor chip on a circuit board via the anisotropic conductive adhesive material by thermocompression bonding.

Protruded electrodes 3a1 and 3a2 of a source driver chip 3 are formed in a protruding condition at locations closer to the center by a dimension L from longitudinal end faces 3b1 and 3b2 of the source driver chip 3, respectively. The dimension L is determined by L=2A+B, where the installation precision of the anisotropic conductive adhesive material 9 is ±A mm and an amount of extension of the anisotropic conductive adhesive material 9 to one side in the widthwise direction at the time of thermocompression bonding is B mm. A width w of the anisotropic conductive adhesive material 9 is so set that longitudinal end faces 9b1 and 9b2 thereof may be closer to the corresponding longitudinal end faces 3b1 and 3b2 of the source driver chip 3 by a dimension A from the protruded electrodes 3a1 and 3a2, as shown by a chain double-dashed line when the anisotropic conductive adhesive material 9 is placed at a correct position with no deviations.