To provide a semiconductor device wherein a heat dissipator is arranged on the upper and lower surfaces of a resin sealed body by mounting a semiconductor element, wherein an external lead is electrically connected with a conductor member to an electrode plate, and exposing a part of the electrode plate and a part of the conductor member over the outside of the resin sealed body.
The semiconductor device is provided with an electrode plate as a first heat dissipator part wherein a semiconductor element 10 is mounted; a conductor member 2 that is joined with the semiconductor element and is connected with its external lead 4; and a resin sealing body 1 that covers at least a part of the semiconductor element, a part of the electrode plate and the conductor member, and a part of the external lead. The part of the electrode plate is exposed from the resin sealing body to make a first heat dissipator, and a second heat dissipator comprised of a heat dissipation plate joined with the conductor member or the conductor member exposed from the resin sealing body is formed on an opposite surface to a surface where the electrode plate of the resin sealing body is exposed. Thus, a heat producing from the semiconductor element is effectively discharged from both surfaces.
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TOJO YOSHIHIKO
USUDA OSAMU
KURAHASHI KAZUHIKO
NEZU HIDETSUGU
Next Patent: METHOD AND APPARATUS OF MANUFACTURING SEMICONDUCTOR APPARATUS