Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2007048915
Kind Code:
A
Abstract:
To provide a semiconductor device which can easily and electrically be connected to an outside and can prevent damages of a chip.
In the semiconductor device, a chip has a support semiconductor layer (10), an insulating layer (12) provided on the support semiconductor layer (10), and an upper semiconductor layer (14) provided on the insulating layer (12). The chip has a mounting board (30) mounted on the side of the support semiconductor layer, and a connecting means (22) (wire) which passes through an opening formed in the upper semiconductor layer (14) and the insulating layer (12) of the chip to be electrically connected from the surface of the support semiconductor layer.
Inventors:
YAMAJI TAKAYUKI
ISHIKAWA HIROSHI
KATSUKI TAKASHI
TAKAHASHI YUJI
NAKAZAWA FUMIHIKO
SANO SATOSHI
ISHIKAWA HIROSHI
KATSUKI TAKASHI
TAKAHASHI YUJI
NAKAZAWA FUMIHIKO
SANO SATOSHI
Application Number:
JP2005231363A
Publication Date:
February 22, 2007
Filing Date:
August 09, 2005
Export Citation:
Assignee:
FUJITSU MEDIA DEVICE KK
FUJITSU LTD
FUJITSU LTD
International Classes:
H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Shuhei Katayama