To provide a semiconductor device which can relax stress and wherein, even if there are many electrodes, they can be easily positioned.

The semiconductor device is provided with: a semiconductor chip 10 wherein an integrated circuit 12 is formed; first and second resin projections 18 and 20 formed on the semiconductor chip 10; a plurality of electrodes 14 which are arranged in a line in an area between the first and second resin projections 18 and 20 and are electrically connected with the integrated circuit 12; and a plurality of wirings 22 to be electrically connected with the respective electrodes 14. The wirings 22 are formed, reaching alternatively the first and second resin projections 18 and 20.