Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2010205891
Kind Code:
A
Abstract:
To provide a semiconductor device enabling occurrence of peeling of an electrode to be hardly caused regardless of wire bonding junction performed on the electrode electrically connected with the external part of an element.
An organic substance electrode 2 is formed on a ZnO-based semiconductor 1, a wire bonding electrode 3 is formed on the organic substance electrode 2, and a pedestal constituted of an insulating film 4 is disposed in a region which is situated under the wire bonding electrode 3 and defines a part of a region on the ZnO-based semiconductor 1 to prevent peeling of the wire bonding electrode 3.
Inventors:
NAKAHARA TAKESHI
YUJI HIROYUKI
YUJI HIROYUKI
Application Number:
JP2009049202A
Publication Date:
September 16, 2010
Filing Date:
March 03, 2009
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L21/60; H01L31/02
Attorney, Agent or Firm:
Hidekazu Miyoshi
Keishin Terayama
Hiroyuki Miyoshi
Ichitaro Ito
Keishin Terayama
Hiroyuki Miyoshi
Ichitaro Ito