To provide a semiconductor device capable of moderating thermal stress while suppressing a decrease in thermal conductivity of heat generated by a semiconductor element.
A semiconductor module comprises a circuit board, a semiconductor element bonded onto the circuit board by soldering, and fin units 13 bonded to the circuit board. The circuit board is composed by bonding a front metal plate to a surface of a ceramic substrate 14 and a rear metal plate 16 to a rear surface of the ceramic substrate. The fin units 13 which form an uneven shape in a side view are bonded to the rear metal plate 16. In the rear metal plate 16, an inter-fin groove 23 which moderates thermal stress caused by heat generated by the semiconductor element is formed between the fin units 13.
AKIYAMA YASUNARI
JPH0247895A | 1990-02-16 | |||
JPH09329395A | 1997-12-22 | |||
JP2003017627A | 2003-01-17 | |||
JP2006310486A | 2006-11-09 | |||
JPH0831990A | 1996-02-02 |
WO2008078788A1 | 2008-07-03 |
Makoto Onda
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