Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017034003
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device having a high carrier mobility.SOLUTION: A semiconductor device comprises: a SiC layer in which a surface is a face tilted against a {000-1} plane at an angle of not less than 0 degree and not more than 10 degrees or a face having a normal direction tilted against a <000-1> direction at an angle of not less than 80 degrees and not more than 90 degrees; a gate electrode; an insulation film with at least a part being provided between the surface and the gate electrode; and a region with at least a part being provided between the surface and the insulation film, which contains a bond of carbon and carbon.SELECTED DRAWING: Figure 1
Inventors:
SHIMIZU TATSUO
IIJIMA RYOSUKE
IIJIMA RYOSUKE
Application Number:
JP2015149987A
Publication Date:
February 09, 2017
Filing Date:
July 29, 2015
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/28; H01L29/78; H01L21/3205; H01L21/336; H01L21/768; H01L23/532; H01L29/12; H01L29/417; H01L29/739; H01L29/861; H01L29/868
Domestic Patent References:
| JP2007335532A | 2007-12-27 | |||
| JP2010113518A | 2010-05-20 | |||
| JP2015061069A | 2015-03-30 | |||
| JP2013187420A | 2013-09-19 |
Attorney, Agent or Firm:
Tetsuma Ikegami
Akira Sudo
Mitsuyuki Matsuyama
Akira Sudo
Mitsuyuki Matsuyama
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