Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018101736
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To facilitate connection to a plurality of interface circuits arranged on one side of a semiconductor device.SOLUTION: A semiconductor device having a rectangular shape in a plan view includes a plurality of first interface circuits arranged on at least one side of the semiconductor device, a plurality of second interface circuits arranged along the plurality of first interface circuits inside the plurality of first interface circuits in the plan view, and a connection region being provided between the plurality of second interface circuits and brought into contact with the first interface circuit.SELECTED DRAWING: Figure 2
Inventors:
SHIMOKURA SHINTARO
Application Number:
JP2016248142A
Publication Date:
June 28, 2018
Filing Date:
December 21, 2016
Export Citation:
Assignee:
CANON KK
International Classes:
H01L21/822; H01L21/82; H01L25/04; H01L25/065; H01L25/07; H01L25/18; H01L27/04
Attorney, Agent or Firm:
Okabe
Takao Ochi
Koji Yoshizawa
Masami Saito
Takao Ochi
Koji Yoshizawa
Masami Saito
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