Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023088629
Kind Code:
A
Abstract:
To provide a semiconductor device capable of reducing a thermal stress acting on a capacitive element mounted on the device.SOLUTION: A semiconductor device A10 comprises: a first conductive member 11; a first semiconductor element 21 bonded with the first conductive member 11 and conductive to the first conductive member 11; a capacitive element 31 conductive to the first conductive member 11; and a second conductive member 12 conductive to the first semiconductor element and the capacitive element 31. The semiconductor device A10 further comprises a first connection terminal 61 and a second connection terminal 62 conductive to the capacitive element 31. The first connection terminal 61 is conductively bonded with the first conductive member 11. The second connection terminal 62 is conductively bonded with the second conductive member 12. The semiconductor device A10 further comprises a first encapsulation resin 65 that covers the capacitive element 31 and each part of the first connection terminal 61 and the second connection terminal 62. The capacitive element 31 is located apart from the first conductive member 11.SELECTED DRAWING: Figure 7
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Inventors:
HATANO MAIKO
Application Number:
JP2021203476A
Publication Date:
June 27, 2023
Filing Date:
December 15, 2021
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L23/29; H01L25/07
Attorney, Agent or Firm:
Hisashi Usui
Tomokazu Saito
Tomokazu Saito