Title:
半導体装置
Document Type and Number:
Japanese Patent JP4922474
Kind Code:
B2
Abstract:
Disclosed is an attachment material for semiconductor chip bonding, whereby manufacturing a highly reliable semiconductor device, controlling such that a fillet shape does not take on a convex shape, is possible. The disclosed attachment material for semiconductor chip bonding has a shear modulus (Gr) as measured with a viscoelasticity measurement device that is greater than or equal to 1*106 Pa at 25 degrees C; a minimum complex viscosity (?*min) up to the melting point of solder as measured by a rheometer that is less than or equal to 5x101 Pa°s; and the complex viscosity (?*(1Hz)) when measured at 140 degrees C, 1 rad distortion, and a frequency of 1Hz is 0.5-4.5 times the complex viscosity (?*(10Hz)) when measured at 140 degrees C, 1 rad distortion, and a frequency of 10Hz.
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Inventors:
Kohei Takeda
Hideaki Ishizawa
Kin Chizuru
Munehiro Hatai
Nishimura Yoshio
Okayama Hisatoshi
Hideaki Ishizawa
Kin Chizuru
Munehiro Hatai
Nishimura Yoshio
Okayama Hisatoshi
Application Number:
JP2011522345A
Publication Date:
April 25, 2012
Filing Date:
April 08, 2011
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/60; C09J7/00; C09J163/00; C09J201/00; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2008019381A | 2008-01-31 | |||
| JP2008159755A | 2008-07-10 | |||
| JP2007009022A | 2007-01-18 | |||
| JP2003092310A | 2003-03-28 | |||
| JP2005175260A | 2005-06-30 | |||
| JP2005307169A | 2005-11-04 |
Foreign References:
| WO2008018557A1 | 2008-02-14 |
Attorney, Agent or Firm:
Atomi International Patent Office