Title:
半導体装置
Document Type and Number:
Japanese Patent JP5386987
Kind Code:
B2
Inventors:
Yasuhiro Okamoto
Kazuki Daejeon
Hironobu Miyamoto
Kazuki Daejeon
Hironobu Miyamoto
Application Number:
JP2008557019A
Publication Date:
January 15, 2014
Filing Date:
January 30, 2008
Export Citation:
Assignee:
NEC
International Classes:
H01L21/338; H01L21/28; H01L29/12; H01L29/417; H01L29/423; H01L29/49; H01L29/778; H01L29/78; H01L29/812
Domestic Patent References:
JP2006156658A | 2006-06-15 | |||
JPS5879773A | 1983-05-13 | |||
JPH03181138A | 1991-08-07 | |||
JP2006216671A | 2006-08-17 | |||
JP2005217049A | 2005-08-11 | |||
JP2006279032A | 2006-10-12 | |||
JPH10223901A | 1998-08-21 |
Attorney, Agent or Firm:
Shinji Hayami