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Title:
半導体装置
Document Type and Number:
Japanese Patent JP5386987
Kind Code:
B2
Inventors:
Yasuhiro Okamoto
Kazuki Daejeon
Hironobu Miyamoto
Application Number:
JP2008557019A
Publication Date:
January 15, 2014
Filing Date:
January 30, 2008
Export Citation:
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Assignee:
NEC
International Classes:
H01L21/338; H01L21/28; H01L29/12; H01L29/417; H01L29/423; H01L29/49; H01L29/778; H01L29/78; H01L29/812
Domestic Patent References:
JP2006156658A2006-06-15
JPS5879773A1983-05-13
JPH03181138A1991-08-07
JP2006216671A2006-08-17
JP2005217049A2005-08-11
JP2006279032A2006-10-12
JPH10223901A1998-08-21
Attorney, Agent or Firm:
Shinji Hayami



 
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