Title:
Semiconductor device
Document Type and Number:
Japanese Patent JP6341203
Kind Code:
B2
Abstract:
A semiconductor device (100) is provided with: a semiconductor chip (10) that is provided with an electrode pad (12); and a wire (30) that is electrically connected to the electrode pad (12). The wire (30) is configured from a first metal material that is mainly composed of Ag and contains Pd. The electrode pad (12) is configured from a second metal material that is mainly composed of Al. An alloy layer that contains Ag, Al and Pd is formed on a joint part (40) of the wire (30) and the electrode pad (12).
Inventors:
Shingo Ito
Application Number:
JP2015522807A
Publication Date:
June 13, 2018
Filing Date:
June 11, 2014
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2012169374A | ||||
| JP2010114408A | ||||
| JP2009152561A | ||||
| JP2008166314A | ||||
| JP2012049198A |
Attorney, Agent or Firm:
Shinji Hayami
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