Title:
半導体装置
Document Type and Number:
Japanese Patent JP6577374
Kind Code:
B2
Abstract:
A semiconductor device includes a plurality of semiconductor elements including a power semiconductor element, a lead frame including one main surface on which the plurality of semiconductor elements are mounted, a resin that seals the plurality of semiconductor elements and a part of the lead frame where the plurality of semiconductor elements are mounted, and at least one shield member disposed above the plurality of semiconductor elements on a side of the one main surface of the lead frame. The shield member is held by the resin, and the shield member has a higher magnetic permeability or a higher electrical conductivity than the resin.
More Like This:
| JPS5651844 | PROTECTING TAPE FOR SEMICONDUCTOR DEVICE |
Inventors:
Toshiya Tadakuma
Takao
Takao
Application Number:
JP2016007556A
Publication Date:
September 18, 2019
Filing Date:
January 19, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/00; H01L25/07; H01L25/18
Domestic Patent References:
| JP6275742A | ||||
| JP1278052A | ||||
| JP6275741A |
Foreign References:
| US20070267734 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita