Title:
半導体装置
Document Type and Number:
Japanese Patent JP6688409
Kind Code:
B2
Abstract:
To provide a semiconductor device capable of achieving reduction in manufacturing cost.SOLUTION: A semiconductor device 1A comprises: a substrate 100A which has a principal surface 101A and a cavity 105A denting from the principal surface 101A and is composed of a semiconductor material; a wiring layer 200A formed on the substrate 100A; orientation sensor elements 311A, 312A, 313A housed in the cavity 105A; and an encapsulation resin 400A which at lest partially covers the orientation sensor elements 311A, 312A, 313A.SELECTED DRAWING: Figure 3
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Inventors:
Yuichi Nakao
Fuwa Yasuhiro
Fuwa Yasuhiro
Application Number:
JP2019019968A
Publication Date:
April 28, 2020
Filing Date:
February 06, 2019
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L25/04; G01P15/08; G01P15/18; G01R33/02; H01L23/12; H01L23/14; H01L25/18
Domestic Patent References:
| JP2014209091A | ||||
| JP2002299553A | ||||
| JP6275740A | ||||
| JP2009020092A | ||||
| JP2009222650A |
Foreign References:
| US20120104623 |
Attorney, Agent or Firm:
Minoru Yoshida
Nao Usui
Nao Usui