Title:
半導体装置
Document Type and Number:
Japanese Patent JP6848802
Kind Code:
B2
Abstract:
A semiconductor device includes: a base plate; a semiconductor chip mounted on the base plate; a case surrounding the semiconductor chip on the base plate; an electrode terminal connected to the semiconductor chip; a sealing material covering an upper face of the base plate, the semiconductor chip and a part of the electrode terminal in the case; and a lid fastened to the case above the sealing material, wherein the electrode terminal is not exposed on an upper face of the sealing material, and there is a gap between the upper face of the sealing material and a lower face of the lid.
Inventors:
Kota Ohara
Gaku Matsumoto
Yoshitaka Otsubo
Gaku Matsumoto
Yoshitaka Otsubo
Application Number:
JP2017197913A
Publication Date:
March 24, 2021
Filing Date:
October 11, 2017
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/34; H01L23/04; H01L23/28; H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| JP9232512A | ||||
| JP2003086722A | ||||
| JP2016181536A | ||||
| JP2003297979A | ||||
| JP4342158A | ||||
| JP2011243798A | ||||
| JP2004014863A | ||||
| JP2017028159A |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno
Hideki Takahashi
Yoshimi Kuno