Title:
半導体装置
Document Type and Number:
Japanese Patent JP6970134
Kind Code:
B2
Abstract:
According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.
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Inventors:
Right
Koichi Ishii
Ikuo Fujiwara
Suzuki Waku
Koichi Ishii
Ikuo Fujiwara
Suzuki Waku
Application Number:
JP2019051077A
Publication Date:
November 24, 2021
Filing Date:
March 19, 2019
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H02N11/00; B81B3/00; G02B26/08; G02B26/10
Domestic Patent References:
| JP2006296138A | ||||
| JP2007312465A | ||||
| JP2010197662A |
Other References:
Ankur Jain, Huikai Xie,A sigle-crystal silicon micromirror for large bi-directional 2D scanning applications,Sensors and Actuators A,2006年,vol 130,454-460
Attorney, Agent or Firm:
Tetsuma Ikegami
Akira Sudo
Masahiro Takashita
Akira Sudo
Masahiro Takashita