Title:
半導体装置
Document Type and Number:
Japanese Patent JP7017202
Kind Code:
B2
Abstract:
To provide a semiconductor device which can improve manufacturing efficiency and join a semiconductor element and a conduction support member more reliably.SOLUTION: A semiconductor device A1 comprises: a semiconductor element 300 having a functional surface 310 where a functional circuit is formed and a rear face 320 facing the opposite direction of the functional surface 310; leads 101 which support the semiconductor element 300 and are conducted to the semiconductor element 300; and a resin package 400 which covers the semiconductor element 300 and at least partially covers the leads 101. The semiconductor element 300 has a functional surface side electrodes 330 which are formed on the functional surface 310 and each includes functional surface side projections 334 which project in a direction in which the functional surface 310 faces; and functional surface side projections 334 of the functional surface side electrode 330 are formed integrally with the leads 101; and a ridge part 334b which is prominent in a direction crossing the direction in which the functional surface 310 faces is formed at a boundary between the functional surface side projections 334 and the leads 101.SELECTED DRAWING: Figure 6
Inventors:
Mamoru Yamagami
Kenji Fujii
Kenji Fujii
Application Number:
JP2017140705A
Publication Date:
February 08, 2022
Filing Date:
July 20, 2017
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/29; H01L23/12; H01L23/31; H01L23/50
Domestic Patent References:
| JP2015207757A | ||||
| JP2013254832A | ||||
| JP2010123680A | ||||
| JP11238753A |
Attorney, Agent or Firm:
Minoru Yoshida
Keita Kobuchi
Keita Kobuchi