Title:
半導体装置
Document Type and Number:
Japanese Patent JP7080161
Kind Code:
B2
Abstract:
A semiconductor device includes a substrate, a plurality of solders, and a semiconductor chip. The plurality of solders are located adjacent to each other. At least one of composition and concentration of the plurality of solders is different from each other. The semiconductor chip includes a joining surface to be joined to the substrate with the plurality of solders. The joining surface of the semiconductor chip includes a plurality of joining areas in which heat generation of the semiconductor chip or a stress on an object to be joined is different from each other. The plurality of solders are disposed to correspond to the plurality of joining areas, respectively.
Inventors:
Isao Oshima
Application Number:
JP2018227786A
Publication Date:
June 03, 2022
Filing Date:
December 05, 2018
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/40; H01L21/52
Domestic Patent References:
| JP2015005571A | ||||
| JP2015088683A | ||||
| JP2017191899A | ||||
| JP2008021716A | ||||
| JP11354687A | ||||
| JP2008238233A | ||||
| JP2009125753A |
Foreign References:
| US20150123259 | ||||
| CN101687284A |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita
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