Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH01181552
Kind Code:
A
Abstract:
PURPOSE:To avoid bends of the leads of a package or degradation of the flatness of contact surfaces of the leads when the package is housed in a magazine by providing protruding metal members whose length of the protruding parts is greater than that of the leads at the four corners of the package. CONSTITUTION:Protruding metal members 3I-3IV are provided at the corners 1A1-1A4 of a package 1. For instance, the protruding metal member 3I at the corner 1A1 of the package 1 is so made as to protrude in the direction parallel to the upper and lower surfaces of the package 1, and as to make the angle between the protruding direction and the side surface 1B and the angle between the protruding direction and the side surface 1C nearly equal to each other. The other protruding metal members 3II-3IV at the corners 1A2-1A4 are made to protrude in the same manner. Therefore, when the semiconductor devices are contained in a magazine, the leads of the respective devices do not interfer with each other and the leads do not touch the magazine. With this constitution, the bends of the leads and the degradation of the flatness of the contact surface of the leads can be avoided.
Inventors:
SUZUKI HIROMICHI
NAITO TAKAHIRO
MURAKAMI HAJIME
TANAKA HIDEKI
NAITO TAKAHIRO
MURAKAMI HAJIME
TANAKA HIDEKI
Application Number:
JP336988A
Publication Date:
July 19, 1989
Filing Date:
January 11, 1988
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/28; H01L23/50; (IPC1-7): H01L23/28; H01L23/50
Attorney, Agent or Firm:
Akita Haruki