PURPOSE: To obtain a semiconductor device having a tape wherein a support spring moves in parallel only, and does not generate deformation even if heat is applied at the time of ILB, by imparting spring action to linking members installed between each of the segments into which the support ring is divided and a base film.

CONSTITUTION: A semiconductor device has a tape 1 constituted of the following; a frame type base film 3, a device hole formed in the part surrounded by the base film 3, a support ring 5 which surrounds the periphery of the device hole, is surrounded by the base film 3, and is divided into a plurality of segments, and a plurality of leads 6 which are fixed on the upper surface of the support ring 5, and whose inner lead part 61 and outer lead part protrude respectively from each of the inner and outer edge parts of the support ring 5. Spring action is imparted to linking members 7 installed between each segment of the support ring 5 and the base film 3. For example, the above- mentioned linking member 7 is a spring-provided suspender 8 to which spring action is imparted.