PURPOSE: To prevent generation of voids, a disconnection, warpage of a wire due to corrosion of an aluminum electrode, and to cope with an increase in size of a semiconductor chip by adhesively securing the chip to a lead frame by using conductive paste containing special compound.

CONSTITUTION: After bisphenol block urethane polymer, polyhydric alcohol compound, and conductive powder having 10μm or less of mean particle size are sufficiently mixed, the mixture is kneaded, for example, by three rolls, then pressure-reduced, and defoamed to manufacture conductive paste. The thus manufactured paste is filled in a syringe, discharged on a lead frame by using a dispenser, a semiconductor element is connected, then wire bonded, and sealed to manufacture a semiconductor device. Even if the obtained device is heated at 280°C, a warpage deformation of a large-sized chip is extremely small, excellent moisture resistance, hydrolysis resistance and adhesive are provided. And, generation of voids, a disconnection, warpage of a wire due to corrosion of an aluminum electrode can be prevented.