Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0513624
Kind Code:
A
Abstract:
PURPOSE: To provide a low-cost, thin semiconductor device widely using a general-purpose lead frame to facilitate the manufacturing.
CONSTITUTION: An IC chip 1 is fixed with an insulating film 2 in such a manner that pad surfaces on it are flush with the surface of inner leads 4. The IC chip and inner leads are electrically connected by metal wire 5. The metal wire is laid along the film 2 to keep its loop as low as possible. The film serves to keep the wire insulated. Then, the chip is molded with resin 6.
More Like This:
| JP2002110848 | SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF |
| JPS63299150 | SEMICONDUCTOR DEVICE |
| JP2573432 | [Name of device] Image sensor |
Inventors:
KUSAKA KENICHI
Application Number:
JP16535391A
Publication Date:
January 22, 1993
Filing Date:
July 05, 1991
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/29; H01L23/31; (IPC1-7): H01L23/29; H01L23/31
Attorney, Agent or Firm:
Mamoru Takada (1 person outside)
Next Patent: JPS513625