Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH06181235
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor package capable of reducing the size of a semiconductor chip, capable of providing leads with high density, and capable of improving the signal transfer characteristic.
CONSTITUTION: A plurality of pads 2 are formed on the surface of a semiconductor chip 1. And a plurality of leads 4, 5, and 6 are electrically connected corresponding to the pads 2 respectively. The leads 4, 5, and 6 are insulated from one another by insulating substances 7a and 7b, and are laminated in the direction of the height from the surface of the semiconductor chip 1.
Inventors:
NODA HIROSHI
NISHIO SATOSHI
NISHIO SATOSHI
Application Number:
JP33282292A
Publication Date:
June 28, 1994
Filing Date:
December 14, 1992
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/60; H01L23/50; (IPC1-7): H01L21/60; H01L23/50
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)