Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH06196511
Kind Code:
A
Abstract:
PURPOSE: To improve adhesion of the rear of a semiconductor chip to a lead frame in a semiconductor device, and reduce thermal resistance.
CONSTITUTION: An uneven part 12 where the difference between the mountain part and the valley part is 0.5-20.5μm is formed on the rear of the semiconductor chip 14 in a semiconductor device 10, and fixed on a die pad 18A of a lead frame. The semiconductor device is encapsulated by using resin mold 22.
Inventors:
HAMAGISHI KENJI
Application Number:
JP34425892A
Publication Date:
July 15, 1994
Filing Date:
December 24, 1992
Export Citation:
Assignee:
KAWASAKI STEEL CO
International Classes:
H01L21/52; H01L29/06; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Keisuke Matsuyama (2 outside)