Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH08111477
Kind Code:
A
Abstract:
PURPOSE: To enhance adhesion of sealing resin to a board by forming a sealing resin layer directly on the surface of a substrate including a conductor circuit not through a solder resist layer.
CONSTITUTION: A plurality of conductor circuits 1 are formed on the surface of a semiconductor mounting board 2 and then a sealing resin layer 5 is formed directly thereon. The material for forming the sealing resin layer 5 is not limited but a material principally comprising an epoxy resin and a phenol resin is employed, for example. Since the sealing resin layer 5 is formed directly on the surface of the substrate 2, not through a solder resist layer 3 poor in adhesion, adhesion of the sealing resin layer 5 to the board 2 is enhanced.
Inventors:
IKEMURA KAZUHIRO
AKIZUKI SHINYA
SHUDO SHINICHIRO
KUWAMURA MAKOTO
FUKUSHIMA TAKASHI
ITO TATSUSHI
AKIZUKI SHINYA
SHUDO SHINICHIRO
KUWAMURA MAKOTO
FUKUSHIMA TAKASHI
ITO TATSUSHI
Application Number:
JP24403394A
Publication Date:
April 30, 1996
Filing Date:
October 07, 1994
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L23/28; H01L23/02; H05K1/03; H05K3/28; (IPC1-7): H01L23/28; H01L23/02; H05K1/03; H05K3/28
Attorney, Agent or Firm:
Nishihiko Yasuhiko
Previous Patent: BASE AND PRODUCTION OF SEMICONDUCTOR DEVICE EMPLOYING THE SAME
Next Patent: HEAT RADIATOR FOR ELECTRONIC APPARATUS
Next Patent: HEAT RADIATOR FOR ELECTRONIC APPARATUS