To provide a semiconductor device in which bond can be prevented from crawling up and adhering to a bonding tool upon thermocompression bonding.

A semiconductor device 1, packaged on a substrate 3 with a bond 5 by thermocompression bonding, has a rise prevention member 6 on its side surface. The rise of the bond 5 occurs upon thermocompression bonding when the bond 5 is heated, and immediately before it sets, it adheres to the side surface of the semiconductor device 1 by surface tension and crawls up, due to the reduction in the viscosity of the bond. The crawling up of the bond can be prevented by changing the shape of the side surface of the semiconductor device 1. The rise prevention member 6 may have a step or a tapered shape which prevents the bond 5 from crawling up via the semiconductor device 1 to adhere to the lower surface of a compression bonding tool 7 upon thermocompression bonding.