Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5259576
Kind Code:
A
Abstract:
PURPOSE:To eliminate shorting accidents owing to conductive foreign materials at the time of face-down bonding by depositing an Si3N4 film on the rear of a semiconductor substrate where there are no circuit wirings.
Inventors:
NAKAMURA MASARU
Application Number:
JP13600975A
Publication Date:
May 17, 1977
Filing Date:
November 11, 1975
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; H01L21/28; H01L21/283; H01L21/31; H01L21/318; H01L23/12; (IPC1-7): H01L21/28; H01L21/31; H01L23/12
Domestic Patent References:
| JP40024861A | ||||
| JP46038172A |