Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS60250654
Kind Code:
A
Abstract:
PURPOSE: To visually inspect the interior by forming the cap of a ceramic package of a transparent material.
CONSTITUTION: A semiconductor chip 1 is contained fixedly in a ceramic case 1, wired at 4 to hermetically seal a cap 5 of transparent sapphire, quartz glass or hard glass between Au plating layers with AuSn eutectic solder 6. Since the cap is transparent, the interior can be directly visually inspected. Accordingly, a malfunction which can be detected only by indirect manner can be effectively detected to improve the quality.
More Like This:
| WO/2019/148270 | SURFACE MOUNT PACKAGING FOR SINGLE MODE ELECTRO-OPTICAL MODULE |
| JP3979610 | Composite magnetic material |
Inventors:
SASAKI HISAO
TAKEUCHI MAKOTO
TAKEUCHI MAKOTO
Application Number:
JP10573584A
Publication Date:
December 11, 1985
Filing Date:
May 25, 1984
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L23/06; H01L21/66; (IPC1-7): H01L23/06
Attorney, Agent or Firm:
Uchihara Shin