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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS60251653
Kind Code:
A
Abstract:

PURPOSE: To operate semiconductor pellets uniformly by electrically connecting the same regions in mutually different pellets by each exposing first and third regions formed onto semiconductor substrates to the surfaces and severally leading out electrodes.

CONSTITUTION: Since sections between substrates and sections between first and third regions in pellets 11, 12 are connected in parallel, the pellets are operated equally. Since regions 3, 3, are connected in parallel on the outsides of channel stoppers 6, the outsides of depletion layers, element withstanding voltage increases. Since electrodes 8 for increasing element withstanding voltage are formed outside the pellets, the electrodes are connected easily. To be concrete, the pellets 11, 12 are fixed onto a metallic plate 12 on an insulating substrate 11 through brazing, etc., and each region is connected electrically. Relay terminals 13W15 for connecting the firstWthird regions are shaped. The semiconductor device is manufactured by executing metallic housing, a resin seal, etc. to these parts.


Inventors:
HIDESHIMA MAKOTO
Application Number:
JP10777284A
Publication Date:
December 12, 1985
Filing Date:
May 28, 1984
Export Citation:
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Assignee:
TOSHIBA KK
International Classes:
H01L25/07; H01L23/538; H01L25/18; H01L29/74; (IPC1-7): H01L25/04; H01L29/74
Attorney, Agent or Firm:
Takehiko Suzue