Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6077434
Kind Code:
A
Abstract:
PURPOSE:To readily isolate an improper semiconductor chip by providing a projection on an insulating substrate as a mounting pad. CONSTITUTION:A projection 22a is formed directly under a semiconductor chip 3 on an insulating substrate 11, an area of a mounting pad A is smaller than that of the chip 3, and the peripheral edges of the four sides of the chip 3 are projected from the pad A. When the substrate 11 is heated and the outer peripheral edges of the chip 3 are lifted from below by a jig, it can be readily removed without crack of the chip. According to this construction, the cost of the product can be reduced in a hybrid IC of high density multichip type.
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Inventors:
KAWAKAMI TAKAYOSHI
Application Number:
JP18809283A
Publication Date:
May 02, 1985
Filing Date:
October 04, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/12; H01L21/52; H01L21/58; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Masuo Oiwa
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