Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6129139
Kind Code:
A
Abstract:
PURPOSE:To supply a large current by forming the uppermost layer of a bonding pad of a pellet of gold to enable the connection of copper wirings, thereby effectively connecting the pad with the wirings. CONSTITUTION:A pad 10 and an electrode 11 are formed by opening a final passivation film 15 at part of aluminum wirings 13 formed on an insulating film 12, exposing the film, then coating Cr as the first layers 10a, 11a, copper as the second layers 10b, 11b and gold as the third layers 10c, 11c. Thus, the copper wirings 7 can be rigidly mounted by a ball bonding, thereby improving the corrosion resistance of the wirings 7 and the pad 10.
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Inventors:
SEKI MASATOSHI
OTSUKA KANJI
SHIRAI MASAYUKI
SAWARA KUNIZO
OKUYA KEN
OTSUKA KANJI
SHIRAI MASAYUKI
SAWARA KUNIZO
OKUYA KEN
Application Number:
JP14949584A
Publication Date:
February 10, 1986
Filing Date:
July 20, 1984
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; H01L21/603; H01L25/065; H01L25/07; H01L25/18; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Akio Takahashi