Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS63152162
Kind Code:
A
Abstract:
PURPOSE: To perform high-precision mounting with high efficiency, by providing the bottom surface of a resin seal layer with the recess of a guide for positioning, and fitting it on a protrusion for positioning formed on a printed board side.
CONSTITUTION: An external lead 2 is bent up to the same level as the bottom surface of a resin seal layer 1, and a recess 3 for a guide is formed on the bottom of the resin seal layer. Mounting is performed by fitting the recess 3 of resin on a protrusion for positioning on a printed board 6. By arranging asymmetrically the recess 3 with respect to a central point, opposite direction mounting can be prevented.
Inventors:
KAMIOKA JUNJI
Application Number:
JP30077886A
Publication Date:
June 24, 1988
Filing Date:
December 16, 1986
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L23/28; H01L23/50; H05K3/30; H05K3/34; (IPC1-7): H01L23/28; H01L23/50
Attorney, Agent or Firm:
Uchihara Shin