PURPOSE: To reduce an external malfunction of a product by providing a groove on at least part of resin sealing surface of a semiconductor module to improve the bondability of the module to a card body and to reduce the difference of heights of the module and the card body.

CONSTITUTION: A groove 6 of recess section is formed in a matrix on the sealing resin 2 of a semiconductor module 1. when the module 1 is associated with a card body 4, if the thicknesses of the modules 1 and the quantity of an adhesive 5 are irregular, even if the quantity of the adhesive 5 is excessively filled, the excessive adhesive 5' is introduced into the groove 6 to reduce the difference of the heights of the module 1 and the card body 4. Accordingly, an external malfunction can be reduced. Since the bonding area of the adhesive 5 and the module 1 is widened, the bonding strength can be increased.