Title:
半導体装置、回路基板および電気光学装置
Document Type and Number:
Japanese Patent JP3979368
Kind Code:
B2
Abstract:
To provide a semiconductor device, a circuit substrate provided with the semiconductor device and an electro-optical device capable of securing accuracy at the position of a disposition at the time of mounting and capable of improving the strength of a junction to a temperature cycle added after the mounting is performed.
In the semiconductor device having an electrode 101 that electrically contacts a conductive layer which is a mounted object and a structure 102 which more protrudes than the electrode 101 and is shaped into a predetermined pattern formed of a resin, the structure 102 is provided with a recess 106 or a salient corresponding to the recess or the salient which is the mounted object.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Hidetaka Saito
Application Number:
JP2003319981A
Publication Date:
September 19, 2007
Filing Date:
September 11, 2003
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G02F1/1345; H01L21/60; H01L23/12; H01L51/50; H05B33/14; H05K3/34
Domestic Patent References:
| JP10308411A | ||||
| JP7037932A | ||||
| JP10041426A |
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama
Masatake Shiga
Masakazu Aoyama