Title:
半導体装置、電子機器、及び携帯情報端末
Document Type and Number:
Japanese Patent JP5487352
Kind Code:
B2
Abstract:
To improve the reliability of contact with an anisotropic conductive film in a semiconductor device such as a liquid crystal display panel, a terminal portion of a connecting wiring on an active matrix substrate is electrically connected to an FPC by an anisotropic conductive film. The connecting wiring is made of a lamination film of a metallic film and a transparent conductive film. In the connecting portion with the anisotropic conductive film, a side surface of the connecting wiring is covered with a protecting film made of an insulating material, thereby exposure to air of the metallic film can be avoided.
Inventors:
Shunpei Yamazaki
Application Number:
JP2013132948A
Publication Date:
May 07, 2014
Filing Date:
June 25, 2013
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G02F1/1339; G02F1/1343; H05K3/28; G02F1/1345; G02F1/136; G02F1/1368; G09F9/00; G09F9/30; H01L21/3205; H01L21/60; H01L23/48; H01L23/52; H01L29/786; H01R11/01; H05B44/00; H05K1/11; H05K1/14
Domestic Patent References:
| JP7325295A | ||||
| JP8234225A | ||||
| JP7159804A | ||||
| JP10197891A | ||||
| JP10240150A | ||||
| JP8234212A | ||||
| JP11002830A | ||||
| JP4039625A | ||||
| JP4163528A | ||||
| JP10039334A | ||||
| JP10170940A | ||||
| JP11084386A |