Title:
半導体装置、及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5870574
Kind Code:
B2
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Inventors:
Ken Nakata
Keiichi Yui
Hiroyuki Ichikawa
Keiichi Yui
Hiroyuki Ichikawa
Application Number:
JP2011206120A
Publication Date:
March 01, 2016
Filing Date:
September 21, 2011
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/338; H01L21/205; H01L29/778; H01L29/812
Domestic Patent References:
| JP2008159842A | ||||
| JP2005235935A | ||||
| JP2009194002A | ||||
| JP2010123899A | ||||
| JP2007294769A | ||||
| JP2002319593A | ||||
| JP2013004681A | ||||
| JP2000068498A | ||||
| JP2011035065A | ||||
| JP2006332367A |
Attorney, Agent or Firm:
Shuhei Katayama