Title:
SEMICONDUCTOR DEVICE AND MOUNTING BOARD
Document Type and Number:
Japanese Patent JP2023140154
Kind Code:
A
Abstract:
To provide a semiconductor device and a mounting board in which a component with high power consumption such as a CPU component does not cause thermal interference with a component with low power consumption such as a memory component.SOLUTION: A semiconductor device 10 includes an interposer 20 including an insulator 21 and a conductor 22, a semiconductor chip group 30 including a first semiconductor chip 31 and a second semiconductor chip 32 located on the interposer and electrically connected to the conductor, and a heat dissipation member 40 including a first portion 41 that overlaps the first semiconductor chip 31 in a plan view, and a second portion 42 that overlaps the second semiconductor chip 32 in a plan view. The heat dissipation member 40 includes a heat transfer surface 401 facing the semiconductor chip group 30, and a heat dissipation surface 402 located on the opposite side of the heat transfer surface and having a larger surface area than the heat transfer surface. The heat dissipation member 40 is formed with a slit 50 that is located between the first portion 41 and the second portion 42 in plan view, and penetrates the heat dissipation member 40.SELECTED DRAWING: Figure 1
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Inventors:
TAI TAKAHIRO
FUJIMOTO KOJI
FUJIMOTO KOJI
Application Number:
JP2022046042A
Publication Date:
October 04, 2023
Filing Date:
March 22, 2022
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L23/36; H01L25/04; H01L25/10
Attorney, Agent or Firm:
Yukitaka Nakamura
Manabu Miyajima
Yukihiro Hotta
Kazuo Okamura
Manabu Miyajima
Yukihiro Hotta
Kazuo Okamura